WireFlow PCB Test Solution

Test expert services

To set up a complete environment can be quite a comprehensive task, especially if you haven’t done it before.

Do you want to deliver quality?

To focus on design and cost is important but remember that production test is the final safety net before your products reach your customers. Without a reliable test solution, you can suffer costly returns and worst of all a damaged reputation.

At WireFlow we can help you out from the beginning of your new product – we can review your PCB design to make sure it’s testable.

It’s up to you how much you want to do yourself and which parts you want us to do.

We know production

With hands-on experience in real-world production environments, we understand the challenges and demands that come with delivering high-quality results at scale.

We support you in structuring the production flow after the PCB has been assembled. The first critical step is the PCBA test, which verifies that the board functions correctly after all components have been mounted.

Following this, the process typically involves housing the PCB or assembling multiple PCBs into a complete unit. This step is called box build. To ensure the final product meets quality standards, an End-of-Line (EOL) test is performed. This final test guarantees that your customer receives a fully functional and reliable product.

Minimizing waste during the production test phase is essential for achieving efficient and cost-effective manufacturing. By applying the principles of Lean Manufacturing, it’s possible to streamline the testing process, enhance product quality, and improve overall throughput.

A key strategy is to establish a continuous flow, where each step in the process is seamlessly connected. When Lean principles are used to create this flow, the result is a highly efficient production system that can quickly adapt to changes in demand, reduce lead times, and maintain consistent quality.

One practical solution to achieve this is to combine the PCBA and End-of-Line (EOL) tests into a single, balanced station. In this setup, the operator can box the finished product while the next PCB is being tested. This not only reduces handling and waiting time but also ensures a smoother, more synchronized workflow—maximizing both efficiency and resource utilization.

You can rely on us to bring proven solutions, practical insights, and a commitment to operational excellence.

Test coverage

To know the test coverage of your product is the first step. We go through the whole BOM, schematics and PCB design and decides what to verify and which test method that is most suitable.

What’s the best test method?

It is important to define a good test strategy in the early phases, one that decides what different types of testing shall be used; AOI, ICT or Functional testing. Or maybe a combination of all these test methods shall be used? Which test method to use depends on several factors.

AOI or the visual inspection of the products contains both manual inspection at different process steps and Automated Optical Inspection (AOI). The Visual Inspection detects visual problems at components such as missing, rotated, misaligned. The Visual inspection can also detect shorts and opens.

In Circuit Testing (ICT) is standardized and easy method to implement, however it requires many test points on the PCB. For boards with limited space, it might not be possible to add enough test points to make a complete ICT test. Also, it is not possible to test active components such as microcontrollers etc. by using the ICT method. This means that boards with limited space and/or active components will normally require Functional tests complemented with ICT tests of varying degree. ICT is optimal for testing components like resistors, capacitors and diodes.

Functional testing: is a higher level of testing, where the powered circuit board is verified by testing its functionality. This testing is normally required for boards that include integrated circuits like voltage regulators, processors etc. It is not uncommon for a special test software to be executed on embedded processors to obtain good test coverage and fast and stable test cycles.

Test specification

Defining the test with a test specification

The test coverage analysis defines the test requirements and which test method to use for every requirement. The next step is to define how to test by writing a test specification. The test specification contains the test cases that fulfills the test coverage analysis with specified pass/fail criteria.

If there are any microcontrollers on the PCB it’s necessary to be able to create test stimulus like turning on a LED to be able to make the test. The test specification defines what the test software needs to be able to perform and how the test sequence communicates with the test software. The best practise is to separate the test software from the final software since the final software will have several updates during a product life cycle, and changes can interfere with the test parts of the final software. Also, if there is a need to change/add functionality for the test it doesn’t require a product software release.

It’s important to make a start up test once the final software has been downloaded to make sure that your customer receives a working product.

Reliable test systems

Before installing the test system in production it’s important to make sure it’s reliable and finds the errors it was designed for. The test coverage analysis defined what to test and which errors the test shall be able to find. To make sure that the test fulfills the requirements, errors are made on the PCB to make sure the test detects the failures. How this is achieved, and the results are documented in a test validation report.

Another important thing is to make sure that it’s easy to repair a failing board. An easy read test report that points out were to analyse the board is essential. A repair instruction makes it even easier.

An operator instruction is written to make it easy for the test operator to execute the test.

Finally test time and production flow are analysed and optimized and maybe there is a need to be able to communicate with the Manufacturing Execution System (MES)?

Define

Review PCB

Test coverage

Method AOI, ICT, FCT

Test specification

Implement

Assemble fixture

Develop software

LabView, Teststand

Validate

Manipulate PCB

Reliability

Review for repair

Optimize cost

Document

Operator instruction

Repair instruction

Maintenance